FYSS5300 Condensed Matter Physics (8 cr)
Description
Bonding in solids
lattice types, amorphous materials
Reciprocal lattice, diffraction
Defects in solids
Introduction to elasticity and acoustic waves
Phonons, thermal properties of insulators
Dielectrics
Electron density and electronic heat capacity
Bloch’s theorem, band structure
SImplest models of interacting electrons, conductors, insulators
electrical conductivity
semiconductors, magnetism, superconductivity
Learning outcomes
At the end of this course, students will be able to
describe the main bonding mechanisms is solids
know the concept of a lattice and the most important lattice and defect types and the difference between crystalline and amorphous materials
explain the concept of reciprocal lattice, and use it in solving diffraction problems
solve the phonon dispersion relations of the simplest lattices, define the concept of phonon and understand, how they explain the thermal and sonic properties of insulators
describe how dielectrics influence the propagation of EM fields
understand the concept of the free-electron model and to use it to calculate electron density and heat capacity
explain Bloch's theorem and tell how it determines the band structure
describe the nearly-free electron and tight-binding models and explain why some materials are metals and others insulators
describe the concepts of a hole and effective mass and explain how electrical conductivity arises
describe the basic principles of semiconductors, magnetism and superconductivity
solve simple problems of condensed matter physics
Description of prerequisites
FYSA2031-FYSA2032 Quantum Mechanics, parts A&B or equivalent
FYSA2041-FYSA2042 Statistical Physics, parts A&B or equivalent
Study materials
Literature
- S. Elliott: The physics and chemistry of solids, Wiley 1998, ISBN-13 978-0-471-98195-4.
- C. Kittel: Introduction to Solid State Physics 8th Edition, Wiley 2005, ISBN-13: 978-0471415268.
- H. Ibach and H. Luth: Solid-State Physics: An Introduction to Principles of Materials Science, Springer 2009, ISBN 978-3-540-93804-0.